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INTEGRATED CIRCUITS
DATA SHEET
TDA8926TH Power stage 2 x 50 W class-D audio amplifier
Preliminary specification Supersedes data of 2002 Feb 07 2002 Oct 22
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
CONTENTS 1 2 3 4 5 6 7 8 8.1 8.2 8.2.1 8.2.2 8.3 9 10 11 12 13 14 14.1 FEATURES APPLICATIONS GENERAL DESCRIPTION QUICK REFERENCE DATA ORDERING INFORMATION BLOCK DIAGRAM PINNING FUNCTIONAL DESCRIPTION Power stage Protection Overtemperature Short-circuit across the loudspeaker terminals BTL operation LIMITING VALUES THERMAL CHARACTERISTICS QUALITY SPECIFICATION DC CHARACTERISTICS AC CHARACTERISTICS SWITCHING CHARACTERISTICS Duty factor 15 15.1 15.2 15.3 15.4 15.5 16 17 17.1 17.2 17.3 17.4 17.5 18 19 20
TDA8926TH
TEST AND APPLICATION INFORMATION BTL application Package ground connection Output power Reference design Curves measured in reference design PACKAGE OUTLINE SOLDERING Introduction to soldering surface mount packages Reflow soldering Wave soldering Manual soldering Suitability of surface mount IC packages for wave and reflow soldering methods DATA SHEET STATUS DEFINITIONS DISCLAIMERS
2002 Oct 22
2
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
1 FEATURES 3 GENERAL DESCRIPTION
TDA8926TH
* High efficiency (>94%) * Operating voltage from 15 to 30 V * Very low quiescent current * High output power * Short-circuit proof across the load, only in combination with controller TDA8929T * Diagnostic output * Usable as a stereo Single-Ended (SE) amplifier or as a mono amplifier in Bridge-Tied Load (BTL) * Standby mode * Electrostatic discharge protection (pin to pin) * Thermally protected, only in combination with controller TDA8929T. 2 APPLICATIONS
The TDA8926TH is the switching power stage of a two-chip set for a high efficiency class-D audio power amplifier system. The system is split into two chips: * TDA8926TH: a digital power stage in a HSOP24 power package * TDA8929T: the analog controller chip in a SO24 package. With this chip set a compact 2 x 50 W audio amplifier system can be built, operating with high efficiency and very low dissipation. No heatsink is required, or depending on supply voltage and load, a very small one. The system operates over a wide supply voltage range from 15 up to 30 V and consumes a very low quiescent current.
* Television sets * Home-sound sets * Multimedia systems * All mains fed audio systems * Car audio (boosters). 4 QUICK REFERENCE DATA SYMBOL General; VP = 25 V VP Iq(tot) Po supply voltage total quiescent current efficiency no load connected Po = 30 W RL = 8 ; THD = 10%; VP = 25 V RL = 4 ; THD = 10%; VP = 21 V Mono bridge-tied load configuration Po 5 output power ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA8926TH HSOP24 DESCRIPTION plastic, heatsink small outline package; 24 leads; low stand-off height VERSION SOT566-3 RL = 8 ; THD = 10%; VP = 21 V 80 100 - W 15 - - 30 40 25 35 94 30 45 - - - V mA % PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Stereo single-ended configuration output power 37 50 W W
2002 Oct 22
3
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
6 BLOCK DIAGRAM
TDA8926TH
handbook, full pagewidth
VDD2 VDD1 11 LIM 17 2 3 DRIVER HIGH 4 DRIVER LOW VSS1 VDD2 10 DRIVER HIGH 9 DRIVER LOW OUT2 BOOT2 OUT1 BOOT1
TDA8926TH
EN1 SW1 REL1 STAB DIAG POWERUP
24 21 22 6 23 14 CONTROL AND HANDSHAKE
TEMPERATURE SENSOR AND current CURRENT PROTECTION
temp
EN2 SW2 REL2 STAB
13 16 15 7 1, 7, 12, 18, 20 n.c. CONTROL AND HANDSHAKE
19 VSS(sub)
5
8
MGW139
VSS1 VSS2
Fig.1 Block diagram.
2002 Oct 22
4
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
7 PINNING SYMBOL n.c. VDD1 BOOT1 OUT1 VSS1 STAB n.c. VSS2 OUT2 BOOT2 VDD2 n.c. EN2 POWERUP REL2 SW2 LIM n.c. VSS(sub) n.c. SW1 REL1 DIAG PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 DESCRIPTION not connected positive power supply; channel 1 bootstrap capacitor; channel 1 PWM output; channel 1 negative power supply; channel 1 decoupling internal stabilizer for logic supply not connected negative power supply; channel 2 PWM output; channel 2 bootstrap capacitor; channel 2 positive power supply; channel 2 not connected digital enable input; channel 2 enable input for switching on internal reference sources digital control output; channel 2 digital switch input; channel 2 pin reserved for testing; connect to VSS in the application not connected negative supply (substrate) not connected digital switch input; channel 1 digital control output; channel 1 digital open-drain output for overtemperature and overcurrent report digital enable input; channel 1
SW1 21 n.c. 20 VSS(sub) 19 EN1 24 DIAG 23 REL1 22
handbook, halfpage
TDA8926TH
1 n.c. 2 VDD1 3 BOOT1 4 OUT1 5 VSS1 6 STAB
TDA8926TH
n.c. 18 LIM 17 SW2 16 REL2 15 POWERUP 14 EN2 13 7 n.c. 8 VSS2 9 OUT2 10 BOOT2 11 VDD2 12 n.c.
MGW143
Fig.2 Pin configuration.
EN1
24
2002 Oct 22
5
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
8 FUNCTIONAL DESCRIPTION 8.2 Protection
TDA8926TH
The combination of the TDA8926TH and the controller TDA8929T produces a two-channel audio power amplifier system using the class-D technology (see Fig.3). In the TDA8929T controller the analog audio input signal is converted into a digital Pulse Width Modulation (PWM) signal. The power stage TDA8926TH is used for driving the low-pass filter and the loudspeaker load. It performs a level shift from the low-power digital PWM signal, at logic levels, to a high-power PWM signal that switches between the main supply lines. A 2nd-order low-pass filter converts the PWM signal into an analog audio signal across the loudspeaker. For a description of the controller, see data sheet "TDA8929T, Controller class-D audio amplifier". 8.1 Power stage
Temperature and short-circuit protection sensors are included in the TDA8926TH. The protection circuits are operational only in combination with the controller TDA8929T. In the event that the maximum current or maximum temperature is exceeded the diagnostic output is activated. The controller has to take appropriate measures by shutting down the system. 8.2.1 OVERTEMPERATURE
If the junction temperature (Tj) exceeds 150 C, then pin DIAG becomes LOW. The diagnostic pin is released if the temperature is dropped to approximately 130 C, so there is a hysteresis of approximately 20 C. 8.2.2 SHORT-CIRCUIT ACROSS THE LOUDSPEAKER
TERMINALS
The power stage contains the high-power DMOS switches, the drivers, timing and handshaking between the power switches and some control logic. For protection, a temperature sensor and a maximum current detector are built-in on the chip. For interfacing with the controller chip the following connections are used: * Switch (pins SW1 and SW2): digital inputs; switching from VSS to VSS + 12 V and driving the power DMOS switches * Release (pins REL1 and REL2): digital outputs; switching from VSS to VSS + 12 V; follow SW1 and SW2 with a small delay * Enable (pins EN1 and EN2): digital inputs; at a level of VSS the power DMOS switches are open and the PWM outputs are floating; at a level of VSS + 12 V the power stage is operational and controlled by the switch pin if pin POWERUP is at VSS + 12 V * Power-up (pin POWERUP): analog input; at LOW level with respect to VSS the device is in standby mode and the supply current is practically zero. With a HIGH level on this pin, the device is in operating mode * Diagnostics (pin DIAG): digital open-drain output; pulled to VSS if the temperature or maximum current is exceeded.
When the loudspeaker terminals are short-circuited This will be detected by the current protection. If the output current exceeds the maximum output current of 5 A, then pin DIAG becomes LOW. The controller should shut down the system to prevent damage. Using the TDA8929T the system is shut down within 1 s, and after 220 ms it will attempt to restart the system again. During this time the dissipation is very low, therefore the average dissipation during a short circuit is practically zero.
2002 Oct 22
6
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VDDA VSSA VDDA VSS1 1 IN1- 4 23 REL1 Vi(1) IN1+ 5 SGND1 2 INPUT STAGE PWM MODULATOR 24 SW1 21 EN1 mute SGND VSSA ROSC OSC 7 OSCILLATOR MANAGER STABI 19 STAB STAB 6 22 DIAGCUR 15 DIAGTMP DIAG 23 TEMPERATURE SENSOR AND CURRENT PROTECTION VSS1 VDD2 10 BOOT2 POWERUP 14 SGND SGND2 11 IN2+ 8 13 SW2 Vi(2) IN2- 9 17 PWM2 R fb 12 VSS2(sub) 10 VDD2 18 VSSD 1, 7, 12, 18, 20 n.c. 19 17 5 8 VSS(sub) LIM VSS1 VSS2 INPUT STAGE PWM MODULATOR 14 REL2 mute 16 EN2 EN2 13 CONTROL SW2 16 AND 15 HANDSHAKE REL2 DRIVER HIGH SGND (0 V) REL1 22 SW1 21 CONTROL AND 24 HANDSHAKE EN1 DRIVER HIGH 4 DRIVER LOW OUT1 VDD1 3 R fb 20 PWM1 VDDD VDD2 VDD1 11 2 +25 V
Philips Semiconductors
Power stage 2 x 50 W class-D audio amplifier
TDA8929T
TDA8926TH
3
BOOT1
Fig.3 Typical application schematic of the class-D system using the controller TDA8929T and the TDA8926TH.
handbook, full pagewidth
7
VMODE MODE 6 MODE VSSA VDDA
9 OUT2
DRIVER LOW
Preliminary specification
-25 V VSSD VSSA
MBL510
TDA8926TH
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
8.3 BTL operation
TDA8926TH
In this way the system operates as a mono BTL amplifier and with the same loudspeaker impedance a four times higher output power can be obtained. For more information see Chapter 15.
BTL operation can be achieved by driving the audio input channels of the controller in the opposite phase and by connecting the loudspeaker with a BTL output filter between the two outputs (pins OUT1 and OUT2) of the power stage (see Fig.4).
handbook, full pagewidth
VDD2 VDD1 11 2 3 DRIVER HIGH 4 DRIVER LOW VSS1 VDD2 10 DRIVER HIGH 9 DRIVER LOW 19 17 5 8
MBL511
TDA8926TH
24 21 22 6 23 14 TEMPERATURE SENSOR AND current CURRENT PROTECTION temp CONTROL AND HANDSHAKE
BOOT1
EN1 SW1 REL1 STAB DIAG POWERUP
OUT1
SGND (0 V) BOOT2
EN2 SW2 REL2
13 16 15 CONTROL AND HANDSHAKE
OUT2
1, 7, 12, 18, 20 n.c.
VSS(sub) LIM VSS1 VSS2
Fig.4 Mono BTL application.
2002 Oct 22
8
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
9 LIMITING VALUES In accordance with the Absolute Maximum Rate System (IEC 60134). SYMBOL VP VP(sc) IORM Tstg Tamb Tvj Ves(HBM) PARAMETER supply voltage supply voltage for short-circuits across the load repetitive peak current in output pins storage temperature ambient temperature virtual junction temperature electrostatic discharge voltage (HBM) note 1 all pins with respect to VDD (class 1a) -1000 all pins with respect to VSS (class 1a) -1000 all pins with respect to each other (class 1a) Ves(MM) electrostatic discharge voltage (MM) note 2 all pins with respect to VDD (class A1) -150 all pins with respect to VSS (class B) all pins with respect to each other (class A1) Notes 1. Human Body Model (HBM); Rs = 1500 ; C = 100 pF. 2. Machine Model (MM); Rs = 10 ; C = 200 pF; L = 0.75 H. 10 THERMAL CHARACTERISTICS SYMBOL Rth(j-a) Rth(j-c) PARAMETER thermal resistance from junction to ambient thermal resistance from junction to case CONDITIONS in free air in free air -200 -100 -500 CONDITIONS - - - -55 -40 - MIN.
TDA8926TH
MAX. 30 30 5 +150 +85 150 +1000 +1000 +500 V V A
UNIT
C C C V V V
+150 +200 +100
V V V
VALUE 40 1
UNIT K/W K/W
11 QUALITY SPECIFICATION In accordance with "SNW-FQ611-part D" if this device is used as an audio amplifier (except for ESD, see also Chapter 9).
2002 Oct 22
9
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
12 DC CHARACTERISTICS VP = 25 V; Tamb = 25 C; measured in test diagram of Fig.6; unless otherwise specified. SYMBOL Supply VP Istb Iq(tot) supply voltage standby current total quiescent current note 1 VEN1 = VEN2 = 0 V; VPOWERUP = 0 V no load connected outputs floating Internal stabilizer logic supply (pin STAB) VO(STAB) VIH VIL VOH VOL VOL ILO VIH VIL VEN(hys) II(EN) VPOWERUP stabilizer output voltage 11 13 - - - - - - 9 5 4 - 15 - - - 25 25 35 5 PARAMETER CONDITIONS MIN. TYP.
TDA8926TH
MAX. 30 100 45 10
UNIT
V A mA mA
15
V
Switch inputs (pins SW1 and SW2) HIGH-level input voltage LOW-level input voltage referenced to VSS referenced to VSS referenced to VSS referenced to VSS IDIAG = 1 mA; note 2 no error condition 10 0 VSTAB 2 V V
Control outputs (pins REL1 and REL2) HIGH-level output voltage LOW-level output voltage 10 0 VSTAB 2 V V
Diagnostic output (pin DIAG, open-drain) LOW-level output voltage output leakage current 0 - - 0 - - referenced to VSS operating level standby level II(POWERUP) Tdiag Thys Notes 1. The circuit is DC adjusted at VP = 15 to 30 V. 2. Temperature sensor or maximum current sensor activated. input current VPOWERUP = 12 V Temperature protection temperature activating diagnostic VDIAG = VDIAG(LOW) hysteresis on temperature diagnostic VDIAG = VDIAG(LOW) 150 - - 20 - - C C 5 0 - - - 100 12 2 170 V V A 1.0 50 V A V V V A
Enable inputs (pins EN1 and EN2) HIGH-level input voltage LOW-level input voltage hysteresis voltage input current referenced to VSS referenced to VSS VSTAB - - 300
Switching-on input (pin POWERUP) switching-on input voltage
2002 Oct 22
10
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
13 AC CHARACTERISTICS SYMBOL PARAMETER CONDITIONS RL = 8 ; THD = 0.5%; VP = 25 V RL = 8 ; THD = 10%; VP = 25 V RL = 4 ; THD = 0.5%; VP = 21 V RL = 4 ; THD = 10%; VP = 21 V THD total harmonic distortion Po = 1 W; note 3 fi = 1 kHz fi = 10 kHz Gv(cl) Po closed-loop voltage gain efficiency Po = 30 W; fi = 1 kHz; note 4 RL = 8 ; VP = 21 V THD = 0.5% THD = 10% THD total harmonic distortion Po = 1 W; note 3 fi = 1 kHz fi = 10 kHz Gv(cl) Notes closed loop voltage gain efficiency Po = 30 W; fi = 1 kHz; note 4 - - 35 - 70(2) 80(2) 80 - - 29 - MIN.
TDA8926TH
TYP.
MAX. - - - - 0.05 - 31 -
UNIT
Single-ended application; note 1 Po output power 25(2) 30(2) 30(2) 40(2) 30 37 40 50 0.01 0.1 30 94 W W W W % % dB %
Mono BTL application; note 5 output power - - 0.05 - 37 - W W % % dB %
100 0.01 0.1 36 94
1. VP = 25 V; RL = 4 ; fi = 1 kHz; fosc = 310 kHz; Rs = 0.1 (series resistance of filter coil); Tamb = 25 C; measured in reference design (SE application) shown in Fig.7; unless otherwise specified. 2. Indirectly measured; based on Rds(on) measurement. 3. Total Harmonic Distortion (THD) is measured in a bandwidth of 22 Hz to 22 kHz. When distortion is measured using a low-order low-pass filter a significantly higher value will be found, due to the switching frequency outside the audio band. 4. Efficiency for power stage; output power measured across the loudspeaker load. 5. VP = 25 V; RL = 8 ; fi = 1 kHz; fosc = 310 kHz; Rs = 0.1 (series resistance of filter coil); Tamb = 25 C; measured in reference design (BTL application) shown in Fig.4; unless otherwise specified.
2002 Oct 22
11
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
14 SWITCHING CHARACTERISTICS VP = 25 V; Tamb = 25 C; measured in Fig.6; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. - - - from pin SW1 (SW2) to pin OUT1 (OUT2) note 1 - - -
TDA8926TH
TYP.
MAX. - - - - 270 0.3
UNIT
PWM outputs (pins OUT1 and OUT2); see Fig.5 tr tf tblank tPD tW(min) Rds(on) Note 1. When used in combination with controller TDA8929T, the effective minimum pulse width during clipping is 0.5tW(min). 14.1 Duty factor rise time fall time blanking time propagation delay minimum pulse width on-resistance of the output transistors 30 30 70 20 220 0.2 ns ns ns ns ns
For the practical useable minimum and maximum duty factor () which determines the maximum output power: t W(min) x f osc t W(min) x f osc ------------------------------- x 100% < < 1 - ------------------------------ x 100% - 2 2 Using the typical value this becomes 3.5% < < 96.5%.
2002 Oct 22
12
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
TDA8926TH
handbook, full pagewidth
1/f osc VDD PWM output (V) 0V
VSS tr t PD VSTAB VSW (V) VSS tf t blank
VSTAB VREL (V) VSS 100 ns
MGW145
Fig.5 Timing diagram PWM output, switch and release signals.
2002 Oct 22
13
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12 k EN1 24 SW1 21 REL1 22 STAB 6 DIAG 23 12 V POWERUP 14 TEMPERATURE SENSOR AND current CURRENT PROTECTION temp VSS1 VDD2 10 DRIVER HIGH 9 DRIVER LOW 19 17 5 8 VOUT2 V BOOT2 CONTROL AND HANDSHAKE DRIVER HIGH 4 DRIVER LOW VOUT1 V 2VDD 15 nF OUT1
15 TEST AND APPLICATION INFORMATION
Philips Semiconductors
handbook, full pagewidth
Power stage 2 x 50 W class-D audio amplifier
VDD2 11
VDD1 2 3 BOOT1
TDA8926TH
14
100 nF VPOWERUP V VEN VSW1
12 V 0
EN2 13 SW2 16 REL2 15 V VREL1 VSTAB V VDIAG VSW2
12 V 0
15 nF OUT2
CONTROL AND HANDSHAKE
V VREL2 1, 7, 12, 18, 20 n.c. VSS(sub) LIM VSS1 VSS2
MBL509
Preliminary specification
TDA8926TH
Fig.6 Test diagram.
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
15.1 BTL application
TDA8926TH
When using the system in a mono BTL application (for more output power), the inputs of both channels of the PWM modulator must be connected in parallel; the phase of one of the inputs must be inverted. In principle the loudspeaker can be connected between the outputs of the two single-ended demodulation filters. 15.2 Package ground connection
The heatsink of the TDA8926TH is connected internally to VSS. 15.3 Output power
The output power in single-ended applications can be estimated using the formula
2 RL ------------------------------------------------ x V P x ( 1 - t W(min) x f osc ) ( R L + R ds(on) + R s ) = -------------------------------------------------------------------------------------------------------------------------2 x RL
P o(1%)
[ V P x ( 1 - t W(min) x f osc ) ] The maximum current I O(max) = --------------------------------------------------------------- should not exceed 5 A. R L + R ds(on) + R s The output power in BTL applications can be estimated using the formula
2 RL --------------------------------------------------------- x 2V P x ( 1 - t W(min) x f osc ) R L + 2 x ( R ds(on) + R s ) = --------------------------------------------------------------------------------------------------------------------------------------2 x RL
P o(1%)
[ 2V P x ( 1 - t W(min) x f osc ) ] The maximum current I O(max) = -------------------------------------------------------------------- should not exceed 5 A. R L + 2 x ( R ds(on) + R s ) Where: RL = load impedance Rs = series resistance of filter coil Po(1%) = output power just at clipping The output power at THD = 10%: Po(10%) = 1.25 x Po(1%). 15.4 Reference design
The reference design for a two-chip class-D audio amplifier for TDA8926TH and controller TDA8929T is shown in Fig.7.
2002 Oct 22
15
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C5 470 nF
Philips Semiconductors
Power stage 2 x 50 W class-D audio amplifier
VDDA R1 39 k
mode select
VDDA R2 39 k 3 6
C11 C12
220 nF 220 nF VSSA VSS(sub) SW2 REL2 EN2
VDDD C24 560 pF VSSD 19 16 15 13 U1 POWERUP C13 220 nF C14 220 nF 8 DIAG 23 POWER STAGE EN1 REL1 SW1 VSSD LIM 5 STAB 10 9 OUT2 C26 15 nF R12 5.6
VSSD C25 560 pF R13 5.6
VDD1 VDD2 MODE 10
VSS2 VSS1 12 1 PWM2 17 SW2 13 REL2 14 EN2 16
QGND C40 15 nF
D1 (5.6 V)
on mute off
S1
C1 220 nF R3 OSC
L2 33 H C36 470 nF VDDD R16 24 C38 220 nF
OUT2-
1 2
4 or 8 SE
GND VSSA (pin 12)
7
27 k C2 220 nF SGND1 GND SGND2 2
U2
BOOT2 VDD1 VDD2 C27 220 nF VSS2 VSS1 C28 220 nF C29 220 nF C31 1500 F (35 V) C32 1500 F (35 V)
C41 15 nF QGND
OUT2+
TDA8929T
19
STAB
14 TDA8926TH 6
2
18 11 22
VSSD
IN1+ C3 330 pF
DIAGCUR
V VSSA SSD C15 180 pF R8 1 k
or 11 TDA8927TH
OUT2-
2
GND C30 220 nF
1
8 BTL
5
CONTROLLER
VSSD C37 470 nF C33 15 nF 33 H L4 R14 5.6 R15 5.6 C35 560 pF
C39 220 nF R17 24
OUT1+ QGND C42 15 nF
IN1- IN2+
4 8
21 23 24
EN1 REL1 SW1 PWM1
24 22 21 17 1, 7, 12, 18, 20 n.c.
3
BOOT1
OUT1-
2 1
J5 J6 C6 470 nF R4 10 k C9 1 nF C7 470 nF R5 10 k
C4 330 pF
OUT1 4
4 or 8 SE
IN2-
9 15
20
C43 15 nF QGND
OUT1+
C8 470 nF R6 10 k C10 1 nF R7 10 k
n.c.
C34 560 pF
outputs
VDDD VSSD QGND C16 100 nF +25 V VDD 1 2 3 VSS C17 100 nF QGND QGND L5 bead VDDD R9 10 k C18 220 nF C19 220 nF C22 47 F (35 V) GND R10 9.1 k bead L6 VSSD C20 220 nF C21 220 nF C23 47 F (35 V) VSSA L7 bead VDDA
V DD(min) - 5.6 V Resistor R1 value ---------------------------------------- . 100 A
Working voltage of SMD capacitors connected between VDD and VSS must be at least 63 V. Capacitors C31 and C32 are electrolytic capacitors with low ESR. Capacitors C36 and C37 are MKT types. R9 and R10 are necessary only in BTL applications with asymmetrical supply. In BTL applications: remove input 2; remove R6, R7, C4, C7 and C8; close J5 and J6. In BTL applications: demodulation coils L2 and L4 should be matched. Inputs referred to QGND (close J1 and J4) or referred to VSS (close J2 and J3).
handbook, full pagewidth
16
input 1 J1 QGND J2 VSS J3 J4
input 2
GND -25 V
QGND
inputs
power supply
MGU717
Preliminary specification
TDA8926TH
Fig.7 Two-chip class-D audio amplifier application diagram for TDA8926TH and controller TDA8929T.
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
15.5 Curves measured in reference design
MLD627
TDA8926TH
102 handbook, halfpage THD+N (%) 10
102 handbook, halfpage THD+N (%) 10
MLD628
1
(1)
1
10-1
10-1
(2)
(1)
10-2
(3)
10-2
(2)
10-3 -2 10
10-1
1
10
102 103 Po (W)
10-3 10
102
103
104
f i (Hz)
105
2 x 8 SE; VP = 25 V. (1) 10 kHz. (2) 1 kHz. (3) 100 Hz.
2 x 8 SE; VP = 25 V. (1) Po = 10 W. (2) Po = 1 W.
Fig.8
Total harmonic distortion plus noise as a function of output power.
Fig.9
Total harmonic distortion plus noise as a function of input frequency.
102 handbook, halfpage THD+N (%) 10
MGU859
102 handbook, halfpage THD+N (%) 10
MLD630
1
(1)
1
(1)
10-1
(2)
10-1
(2)
10-2
(3)
10-2
10-3 10-2
10-1
1
10
102 103 Po (W)
10-3 10
102
103
104
f i (Hz)
105
2 x 4 SE; VP = 21 V. (1) 10 kHz. (2) 1 kHz. (3) 100 Hz.
2 x 4 SE; VP = 21 V. (1) Po = 10 W. (2) Po = 1 W.
Fig.10 Total harmonic distortion plus noise as a function of output power.
Fig.11 Total harmonic distortion plus as a function of input frequency.
2002 Oct 22
17
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
TDA8926TH
102 handbook, halfpage THD+N (%) 10
MGU860
102 handbook, halfpage THD+N (%) 10
MLD632
1
(1)
1
10-1
(2)
10-1
(1)
(2)
10-2
10-2
(3)
10-3 10-2
10-1
1
10
102 103 Po (W)
10-3 10
102
103
104
f i (Hz)
105
1 x 8 BTL; VP = 21 V. (1) 10 kHz. (2) 1 kHz. (3) 100 Hz.
1 x 8 BTL; VP = 21 V. (1) Po = 10 W. (2) Po = 1 W.
Fig.12 Total harmonic distortion plus noise as a function of output power.
Fig.13 Total harmonic distortion plus noise as a function of input frequency.
handbook, halfpage
25
MGU855
handbook, halfpage
100
MGU856
P (W) 20
(%)
(3)
(1) (2)
80
15
(1) (2)
60
10
(3)
40
5
20
0 10-2
10-1
1
10
103 102 Po (W)
0 0 20 40 60 80 100 Po (W)
VP = 21 V; fi = 1 kHz. (1) 2 x 4 SE. (2) 1 x 8 BTL. (3) 2 x 8 SE.
VP = 21 V; fi = 1 kHz. (1) 2 x 4 SE. (2) 1 x 8 BTL. (3) 2 x 8 SE.
Fig.14 Power dissipation as a function of output power.
Fig.15 Efficiency as a function of output power.
2002 Oct 22
18
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
TDA8926TH
handbook, halfpage
200 Po 160
MGU857
handbook, halfpage
200 Po
MGU858
(W)
(W) 160
120
120
(1)
80
(1) (2) (3)
80
(2)
(3)
40
40
0 10
15
20
25
30 VP (V)
35
0 10
15
20
25
30 VP (V)
35
THD + N = 0.5%; fi = 1 kHz. (1) 1 x 8 BTL. (2) 2 x 4 SE. (3) 2 x 8 SE.
THD + N = 10%; fi = 1 kHz. (1) 1 x 8 BTL. (2) 2 x 4 SE. (3) 2 x 8 SE.
Fig.16 Output power as a function of supply voltage.
Fig.17 Output power as a function of supply voltage.
handbook, halfpage
0 cs -20
MLD613
handbook, halfpage
0 cs -20
MLD614
(dB)
(dB)
-40
-40
-60
(1)
-60
(1)
-80
(2)
-80
(2)
-100
10
102
103
104
f i (Hz)
105
-100
10
102
103
104
f i (Hz)
105
2 x 8 SE; VP = 21 V. (1) Po = 10 W. (2) Po = 1 W.
2 x 4 SE; VP = 21 V. (1) Po = 10 W. (2) Po = 1 W.
Fig.18 Channel separation as a function of input frequency.
Fig.19 Channel separation as a function of input frequency.
2002 Oct 22
19
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
TDA8926TH
handbook, halfpage
45
MLD615
G (dB) 40
handbook, halfpage
45
MLD616
G (dB) 40
35
(1)
(1)
35
(2)
30
(2)
30
(3)
25
(3)
25
20
10
102
103
104
f i (Hz)
105
20
10
102
103
104
f i (Hz)
105
VP = 21 V; Vi = 100 mV; Rs = 10 k/Ci = 330 pF. (1) 1 x 8 BTL. (2) 2 x 8 SE. (3) 2 x 4 SE.
VP = 21 V; Vi = 100 mV; Rs = 0 . (1) 1 x 8 BTL. (2) 2 x 8 SE. (3) 2 x 4 SE.
Fig.20 Gain as a function of input frequency.
Fig.21 Gain as a function of input frequency.
handbook, halfpage
0
MLD617
handbook, halfpage
0
MLD618
SVRR (dB) -20
SVRR (dB) -20
-40
(1)
-40
(1)
-60
(2) (3)
-60
(2) (3)
-80
-80
-100
10
102
103
104
f i (Hz)
105
-100
0
1
2
3
5 4 Vripple(p-p) (V)
VP = 21 V; Vripple(p-p) = 2 V. (1) Both supply lines in antiphase. (2) Both supply lines in phase. (3) One supply line rippled.
VP = 21 V. (1) fripple = 1 kHz. (2) fripple = 100 Hz. (3) fripple = 10 Hz.
Fig.22 Supply voltage ripple rejection as a function of input frequency.
Fig.23 Supply voltage ripple rejection as a function of ripple voltage (peak-to-peak value).
2002 Oct 22
20
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
TDA8926TH
handbook, halfpage
100 Iq
MLD619
handbook, halfpage
380
MLD620
(mA) 80
fclk (kHz)
372
60
364
40
356
20
348
0 0 10 20 30 37.5 VP (V)
340 0 10 20 30 VP (V) RL = open-circuit. 40
RL = open-circuit.
Fig.24 Quiescent current as a function of supply voltage.
Fig.25 Clock frequency as a function of supply voltage.
handbook, halfpage
5 Vripple (V) 4
MLD621
MLD622
handbook, halfpage
5
SVRR (%) 4
3
(1)
3
(1)
2
2
1
(2)
1
(2)
0 10-2
10-1
1
10
Po (W)
102
0 10
102
103
f i (Hz)
104
VP = 21 V; 1500 F per supply line; fi = 10 Hz. (1) 1 x 4 SE. (2) 1 x 8 SE.
VP = 21 V; 1500 F per supply line. (1) Po = 30 W into 1 x 4 SE. (2) Po = 15 W into 1 x 8 SE.
Fig.26 Supply voltage ripple as a function of output power.
Fig.27 Supply voltage ripple rejection as a function of input frequency.
2002 Oct 22
21
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
TDA8926TH
handbook, halfpage
10
MLD623
handbook, halfpage
THD+N (%) 1
(1)
50 Po 40
MLD624
(W)
30 10-1
(2) (3)
20
10-2
10
10-3 100
200
300
400
500 600 fclk (kHz)
0 100
200
300
400
500 600 fclk (kHz)
VP = 21 V; Po = 1 W in 2 x 8 . (1) 10 kHz. (2) 1 kHz. (3) 100 Hz.
VP = 21 V; RL = 2 x 8 ; fi = 1 kHz; THD + N = 10%.
Fig.28 Total harmonic distortion plus noise as a function of clock frequency.
Fig.29 Output power as a function of clock frequency.
handbook, halfpage
150 Iq 120
MLD625
handbook, halfpage
1000
MLD626
Vr(PWM) (mV) 800
(mA)
90
600
60
400
30
200
0 100
200
300
400
500 600 fclk (kHz)
0 100
200
300
400
500 600 fclk (kHz)
VP = 25 V; RL = open circuit.
VP = 25 V; RL = 2 x 8 .
Fig.30 Quiescent current as a function of clock frequency.
Fig.31 PWM residual voltage as a function of clock frequency.
2002 Oct 22
22
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
16 PACKAGE OUTLINE HSOP24: plastic, heatsink small outline package; 24 leads; low stand-off height
TDA8926TH
SOT566-3
E D x
A X
c y E2 HE vM A
D1 D2 1 pin 1 index Q A2 E1 A4 Lp detail X 24 Z e bp 13 wM (A3) A 12
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A A2 max. 3.5 3.5 3.2 A3 0.35 A4(1) bp c D(2) D1 D2 1.1 0.9 E(2) 11.1 10.9 E1 6.2 5.8 E2 2.9 2.5 e 1 HE 14.5 13.9 Lp 1.1 0.8 Q 1.7 1.5 v w x y Z 2.7 2.2 8 0
+0.08 0.53 0.32 16.0 13.0 -0.04 0.40 0.23 15.8 12.6
0.25 0.25 0.03 0.07
Notes 1. Limits per individual lead. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT566-3 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION
ISSUE DATE 02-01-30
2002 Oct 22
23
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
17 SOLDERING 17.1 Introduction to soldering surface mount packages
TDA8926TH
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 17.4 Manual soldering
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. 17.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 220 C for thick/large packages, and below 235 C for small/thin packages. 17.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed.
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
2002 Oct 22
24
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
17.5 Suitability of surface mount IC packages for wave and reflow soldering methods PACKAGE(1) BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC(4), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes not suitable not suitable(3)
TDA8926TH
SOLDERING METHOD WAVE REFLOW(2) suitable suitable suitable suitable suitable
suitable not not recommended(4)(5) recommended(6)
1. For more detailed information on the BGA packages refer to the "(LF)BGA Application Note" (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2002 Oct 22
25
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
18 DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development DEFINITION
TDA8926TH
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
II
Preliminary data Qualification
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 19 DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 20 DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2002 Oct 22
26
Philips Semiconductors
Preliminary specification
Power stage 2 x 50 W class-D audio amplifier
NOTES
TDA8926TH
2002 Oct 22
27
Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2002
SCA74
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
753503/02/pp28
Date of release: 2002
Oct 22
Document order number:
9397 750 09588

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